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IBIS

Final schedule: Click here to open.

Instructions for presenters (oral and poster): Click here to open.

FINAL PROGRAM

WEDNESDAY, 10 MAY 2017

08:30 Registration opens

09:00 - 10:00 SESSION 8: Transmission Line Modeling

Chair: F. Grassi

09:00 - 09:20

Calculations of Frequency Dependent Transmission Line Model for Coupled Exponential Line

A. Wardzinska, and W. Bandurski

Poznan University of Technology, Poland

09:20 - 09:40

An Improved Equivalent Circuit Model of Spoof Surface Plasmon Transmission Line

D. Yi, X.-C. Wei

Zhejiang University, Hangzhou, China

09:40 - 10:00

Transmission Line Model for Rectangular Waveguides accurately incorporating Loss Effects (slides)

K. Lomakin, G. Gold, and K. Helmreich

Friedrich-Alexander University Erlangen-Nuremberg, Germany

10:00 - 10:40 SESSION 9: TSV & 3DIC

Chair: A. Maffucci

10:00 - 10:20

Effect of 3D Stack-Up Integration on Through Silicon Via Characteristics (student paper)

D. Dahl (1), I. Ndip (2), K.-D. Lang (2), and C. Schuster (1)

(1) Hamburg University of Technology (TUHH), Germany, (2) Fraunhofer Institute for Reliability and Microintegration (IZM), Germany, and Technical University of Berlin, Germany

10:20 - 10:40

3D Interconnect Optimization for Single Channel 100-GBps Transmission in a Photonic Interposer

K. Morot (1), A. Farcy (1), T. Lacrevaz (2), C. Bermond (2), P. Artillan (2), B. Flechet (2), H. Jacquinot (3), and P. Scheiblin (3)

(1) STMicroelectronics, France, (2) Université de Savoie Mont-Blanc, France, (3) CEA-LETI, Grenoble, France

10:40 - 11:10 Coffee break

11:10 - 12:10 SESSION 10: Optical & Nano Interconnects

Chair: H. Grabinski

11:10 - 11:30

Plasmonic carbon interconnects to enable the THz technology: properties and limits (slides)

A. Paddubskaya (1), M. Shuba (1), S. Maksimenko (1), and A. Maffucci (2)

(1) Belarusian State University, Mink, Belarus, (2) University of Cassino and Southern Lazio, Italy

11:30 - 11:50

A Performance Comparison of Integrated Graded Index Y-Branch and MMI-Based Optical Splitters in Thin Glass Sheets for PCB Integration (slides)

J.-P. Roth, T. Kuhler, and E. Griese

University of Siegen, Germany

11:50 - 12:10

Analysis of Optical Directional Couplers in Thin Glass Sheets for PCB Integration

J.H. Stosch, T. Kuhler and E. Griese

University of Siegen, Germany

12:10 - 12:30 Closing ceremony

13:30 - 17:20 20th European IBIS Summit

Organized by: IBIS Open Forum

13:30 Sign In, Refreshments

13:45 - 14:00

Welcome and Introduction

Michael Schäder

Zuken, Germany

14:00 - 14:30

Accurate Macromodels of Output Buffers with Pre-/De-emphasis

Gianni Signorini (1), Claudio Siviero (2), Igor Simone Stievano (2), Stefano Grivet-Talocia (2)

(1) Intel Corporation, Germany; (2) Politecnico di Torino, Italy

14:30 - 15:00

Compact Multivariate Surface Approximations for Power-aware I/O models

Claudio Siviero (1), Stefano Grivet-Talocia (1), Gianni Signorini (2), Igor Simone Stievano (1)

(1) Politecnico di Torino, Italy; (2) Intel Corporaton, Germany

15:00 - 15:30

IBIS Update

Mike LaBonte

SiSoft, USA

[Presented by Michael Schäder]

Zuken, Germany

15:30 - 15:45 Coffee Break

15:45 - 16:15

Interconect Modeling Using IBIS-ISS and Touchstone

Michael Mirmak

Intel Corporation, USA

[Presented by Stefan Paret]

CST AG, Germany

16:15 - 16:45

IBIS Extensions for Turn-around Cycle Simulations

Nitin Bhagwath (1), Arpad Muranyi (1), Randy Wolff (2)

(1) Mentor, A Siemens Business, USA; (2) Micron Technology, USA

16:45 - 17:15

Open Discussion

17:15 - 17:20

Closing Remarks

Michael Schäder

Zuken, Germany

17:20 Meeting Ends